Products

Micromanipulated Cryogenic & Vacuum Probe Systems for Chips, Wafers and Device Testing from ~3 K to 475 K

1. LOW FREQUENCY (DC). Tip diameter, radius, and material can be specified by the user to match a specific application and pad size.

1.1 CX: Coaxially shielded low frequency probe with BNC feedthrough and 50 ohm coaxial cryogenic cable.
1.2 TX: Triaxially shielded low frequency probe with triax feedthrough and
50 ohm triaxial cryogenic cable.
1.3 KEL: Kelvin probe, available in either CX or TX configuration. The KEL probe includes two coaxial or triaxial cryogenic cables joined at the probe holder, and wired to separate BNC or triax feedthroughs. One cable is used for forcing current (or voltage) through (or across) the device under test (DUT), and the other cable is used to sense the voltage (or current) passing across (or through) the DUT. KEL probes are typically used for low resistance measurements in order to eliminate cable resistance from the measurement.

2. HIGH FREQUENCY.

2.1 MW: Microwave probes for high frequency measurements. MW probes are available in 40, 50, and 67 GHz ranges, and include low profile probe holders with beryllium copper or tungsten spring loaded tips. The probe configuration and pitch can be specified by the user, as ground-signal-ground (GSG), GS, or SG, with pitch range from 50 - 1250 microns. Each probe is connected to a semi-rigid coaxial cable terminating in a type K or V connector designed for low insertion and low return loss.

3. FIBER OPTIC PROBE ARM. One probe port can be configured to accept an optical fiber, for precise optical excitation of wafers and devices.