lipix
Cernox® sensor packages and mounting adapters

Packages and adapters for Cernox RTDs allow the sensor to be soldered in place, screwed on, bolted down, inserted into a hole, or inserted through a pressure seal in the form of a thermowell. Gold-plated copper bobbins are available in order to heat sink leads. Appendix C: Sensor Packaging and Installation discusses techniques for correctly installing cryogenic temperature sensors. Special packaging is also available—consult Lake Shore for custom orders.

Additional information about Lake Shore sensors and packaging can be found in our Temperature Sensor Selection Guide.

Each sensor package or adapter has been rated for four attributes or characteristics. These ratings give a general idea of how a package will perform and aid in the early decision-making process but are not a substitute for detailed specifications.

temperature-sensor-selection-guide
Cernox® packages
Temperature probes

Some applications require more protection for your sensors (especially if they have to be immersed in liquid). Cryogenic temperature probes are great for those. Encased in a stainless steel thermowell fixture, the sensor can perform as designed, unaffected by high pressure, and sealed to keep electrical components and wiring protected from fluids and other elements.

  • Stainless steel-encased probes that provide high-reliability sensor performance in a thermowell
  • Sealed to keep electrical components and wiring protected from fluids
  • Ideal for temperature measurements in fluid containers and tanks
  • Hermetic feedthrough at the end
  • Also beneficial for extended sensor reach in narrow spaces
  • Available in standard lengths up to 28 in (0.7 m) long
  • Custom lengths and configurations are also available

Temperature probe product page

HR

The HR Series is a new line of high-reliability cryogenic temperature sensors for mission-critical applications. Starting with our proven temperature sensor technology, we have developed a family of off-the-shelf sensors that have already undergone extreme testing steps to assure you of extra reliability.

  • Full material traceability for 15 years
  • Resistance and sensitivity data available for all sensors
  • Reduce lead time
  • Gain confidence from our test protocol
  • No hidden costs—pay only for the sensors you buy

High Reliability sensors page

CX-BC

Packaging material: Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models)

Leads: 2

Lead material: 2.5 mil (42 AWG) bare copper 25 mm long wires

Mass: ≤3.0 mg

CX-BG

Packaging material: Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models)

Leads: 2

Lead material: 2 mil (44 AWG) bare gold 25 mm long wires

Mass: ≤3.0 mg

CX-BR

Packaging material: Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models)

Leads: None

Mass: ≤3.0 mg 

CO
  • Spring-loaded clamp holds standard SD sensor in contact with the surface of the sample and allows the sensor to be easily changed or replaced
  • Extra clamps are available for frequent relocation of the sensor
  • 4-40 stainless steel screw has a formed shoulder, thus applying correct pressure to the clamp

Packaging material, leads, and lead material: See CX-SD package

Adapter material: Gold-plated copper (nickel strike); spring is ASTM A313 302 Austenitic steel

Mass: 1.8 g (including SD package and clamp)

Limitation: The useful upper temperature limit of this configuration is 500 K

ET
  • Convenient screw-in package formed by indium soldering a basic SD configuration into a recess in one flat of a hexagonal screw head
  • The head terminates in a standard #6-32 UNC threaded stud allowing the sensor to be screwed into a mounting hole in the sample
  • Note: A light coating of vacuum grease on the threads further enhances the thermal contact between the sensor package and the sample.

Packaging material, leads, and lead material: See CX-SD package

Adapter material: Gold-plated copper #6-32 UNC screw head

Mass: 1.5 g (including SD package and screw head)

Limitation: Indium solder limits the upper useful temperature of this configuration to 420 K

MT
  • Convenient screw-in package formed by indium soldering a basic SD configuration into a recess in a slot in the center of the hexagonal head
  • The head terminates in a a 3 mm × 0.5 metric threaded stud allowing the sensor to be screwed into a mounting hole in the sample
  • Note: A light coating of vacuum grease on the threads further enhances the thermal contact between the sensor package and the sample.

Packaging material, leads, and lead material: See CX-SD package

Adapter material: Gold-plated copper metric threaded screw head 3 mm × 0.5 metric

Mass: 1.5 g (including SD package and screw head)

Limitation: Indium solder limits the upper useful temperature of this configuration to 420 K

CD
  • AA canister sensor soldered into a flat, copper bobbin with the sensor leads thermally anchored to the bobbin
  • Can be mounted to any flat surface with a 4-40 or M3 screw (not supplied)

Adapter material: Copper bobbin, gold-plated (AA canister epoxied to bobbin)

Leads: 0.91 m (36 in), 36 AWG, color-coded, Quad-Lead™

Lead material: Phosphor bronze Grade A alloy

Limitation: The epoxy limits the upper useful temperature of this configuration to 378 K

LR
  • With an SD packaged sensor mounted on a slightly-more-than half-rounded cylinder, this package is designed to be inserted into a 3.2 mm (1/8 in) diameter hole

Packaging material, leads, and lead material: See CX-SD package

Mass: 0.2 g (Including SD package and disk)

Limitation: Indium solder limits the upper useful temperature of this configuration to 420 K 

BO
  • SD package is soldered to a mounting block and the leads are thermally anchored (without epoxy) to the block via a beryllium oxide insert
  • Since leads can be a significant heat path to the sensing element and can lead to measurement errors when incorrectly anchored, this configuration helps maintain the leads at the same temperature as the sensor
  • Can be mounted to any flat surface with a 4-40 or M3 screw

Packaging material: Gold-plated bolt-on copper block with leads thermally anchored to block (SD indium-soldered to adapter)

Leads and lead material: See CX-SD package

Mass: 1.5 g (including SD package and screw head)

Limitation: Indium solder limits the upper useful temperature of this configuration to 420 K

CX-AA

Adapter material: Gold-plated cylindrical copper canister, BeO header, Stycast® epoxy

Leads: Four 32 AWG × 150 mm (6 in) long

Lead material: Phosphor bronze insulated with polyimide

Mass: ≈390 mg

Limitation: The epoxy limits the upper useful temperature of this configuration to 400 K

CU/CU-HT
  • SD packaged sensor indium-soldered into a flat copper bobbin with the leads thermally anchored to that same bobbin
  • HT (high temperature) version is soldered using high temperature (90% Pb, 10% Sn) solder
  • Can be mounted to any flat surface with a 4-40 or M3 screw

Packaging material: See CX-SD package

Adapter material: Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy); high temperature CU uses high temperature (90% Pb,10% Sn) solder 500 K

Leads: Four 0.91 m (36 in), 36 AWG, color-coded QuadLead™ leads

Lead material: Phosphor bronze alloy

Mass: 1.1 g (including SD package and bobbin, excluding leads)

Limitation: The epoxy limits the upper useful temperature of both CU and CU-HT configurations with Cernox® to 420 K

CX-SD
  • Small package designed primarily for bonding or clamping to a flat surface
  • Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting

Packaging material: Sapphire base with alumina body and lid.

Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal.

Leads: 2

Lead material: Gold-plated copper soldered with 60/40 SnPb

Mass: ≈40 mg

Limitation: The useful upper temperature limit of this configuration is 420 K